Product centerWire-To-Board -A2501

Wafer-2.50mm Pitch,180°,DIP Wafer
Wire-To-Board  | Wire-To-Wire
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesA2501 Series
MaterialNylon 66,UL94V-0
Matching Housing:

A2501H-XP 2.50mm Pitch,Housing,  
A2501HB-XP 2.50mm Pitch,Housing,  

Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 2.50mm
Product Series A2501 Series
Configuration Features Number of Rows  1
Number of Positions  2P~8P
Electrical characteristics Operating Voltage (V AC/DC) 250
Current(Max)(A) 3
Contact Resistance 10mΩMax
Insulation Resistance 1000MΩMin
Shell characteristics Housing Material Nylon 66,UL94V-0
Color  White
PIN Material Brass
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732