Product centerWire-To-Board -A1501

Wafer-1.50mm Pitch,90°,SMT Wafer
Wire-To-Board  | Wire-To-Wire
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesA1501 Series
MaterialNylon 6T,UL94V-0
Matching Housing:

A1501H-XP 1.50mm Pitch,Housing,  

Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 1.50mm
Product Series A1501 Series
Configuration Features Number of Rows  1
Number of Positions  2P~13P
Electrical characteristics Operating Voltage (V AC/DC) 100
Current(Max)(A) 1
Contact Resistance 20mΩMax
Insulation Resistance 500MΩMin
Shell characteristics Housing Material Nylon 6T,UL94V-0
Color  Ivory
PIN Material Brass
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732