Product centerWire-To-Board -A1252

Wafer-1.25mm Pitch,180°,SMT Wafer
A1252WV-S-XP
Wire-To-Board
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesA1252 Series
Pitch1.25mm
MaterialNylon 6T,UL94V-0
ColorIvory
Matching Housing:

A1252H-XP 1.25mm Pitch,Housing,  

Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 1.25mm
Product Series A1252 Series
Configuration Features Number of Rows  1
Number of Positions  2P~15P
Electrical characteristics Operating Voltage (V AC/DC) 150
Current(Max)(A) 1
Contact Resistance 30mΩMax
Insulation Resistance 500MΩMin
Shell characteristics Housing Material Nylon 6T,UL94V-0
Color  Ivory
PIN Material Brass
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732