Product centerWire-To-Board -A1201

Wafer-1.20mm Pitch,90°,SMT Wafer
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesA1201 Series
MaterialNylon 9T,UL94V-0
Matching Housing:

A1201HD-XP 1.20mm Pitch,Housing,  

Product Type Features Category Wire to Board
Assembly Type Wafer
Pitch (mm) 1.20mm
Product Series A1201 Series
Configuration Features Number of Rows  1
Number of Positions  2P~8P
Electrical characteristics Operating Voltage (V AC/DC) 50
Current(Max)(A) 2
Contact Resistance 10mΩMax
Insulation Resistance 100MΩMin
Shell characteristics Housing Material Nylon 9T,UL94V-0
Color  Ivory
PIN Material Phosphor Bronze
PIN Plating Tin over Nickel
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732