Product centerWire-To-Board -A2547

Matching Wafer:

A2547WV-XP 2.54 Pitch,单排180°,DIP Wafer,  
A2547WV-S-XP 2.54 Pitch,单排180°,SMT Wafer,  A2547WV-S-XP-2 2.54 Pitch,单排180°,SMT Wafer,  
A2547WR-XP 2.54 Pitch,单排90°,DIP Wafer,  A2547WR-F-XP 2.54 Pitch,单排90°,DIP Wafer,  
A2547WR-S-F-XP 2.54 Pitch,单排90°,SMT Wafer,  

Matching Housing:

A2547HM-XP 2.54mm Pitch,Housing,  A2547HMA-XP 2.54mm Pitch,Housing,  
A2547HMB-XP 2.54mm Pitch,Housing,  

Matching Terminal:

A2547-T 2.54 Pitch,Crimp Terminal,AWG:22#-24#,  A2547-T-L 2.54 Pitch,Crimp Terminal,AWG:22#-30#,  
A2547-T-C 2.54 Pitch,Crimp Terminal,AWG:22#-24#,  A2547-T-C-L 2.54 Pitch,Crimp Terminal,AWG:22#-30#,  
A2547-T-D 2.54 Pitch,Crimp Terminal,  A2547M-T 2.54 Pitch,Crimp Terminal,AWG:22#-24#,  
A2547M-T-L 2.54 Pitch,Crimp Terminal,AWG:22#-30#,  

Product Type Features Category Wire to Board
Assembly Type Housing
Pitch (mm) 2.54mm
Product Series A2547 Series
Electrical characteristics Operating Voltage (V AC/DC) 250
Current(Max)(A) 3
Contact Resistance 20mΩMax
Insulation Resistance 1000MΩMin
Configuration Features Number of Rows  1
Number of Positions  2P~25P
Shell characteristics Color  Black
Material PBT30%GF,UL94V-0
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732