Product centerWire-To-Board -A2547

Matching Wafer:

A2547WV-XP 2.54 Pitch,单排180°,DIP Wafer,  
A2547WV-S-XP 2.54 Pitch,单排180°,SMT Wafer,  
A2547WV-S-XP-2 2.54 Pitch,单排180°,SMT Wafer,  
A2547WR-XP 2.54 Pitch,单排90°,DIP Wafer,  
A2547WR-F-XP 2.54 Pitch,单排90°,DIP Wafer,  
A2547WR-S-F-XP 2.54 Pitch,单排90°,SMT Wafer,  

Matching Terminal:

A2547-T-E 2.54 Pitch,Crimp Terminal,AWG:22#-26#,  A2547-T-E-H 2.54 Pitch,Crimp Terminal,AWG20#-24#,  
A2547-T-E-L 2.54 Pitch,Crimp Terminal,AWG28#-32#,  

Product Type Features Category Wire to Board
Assembly Type Housing
Pitch (mm) 2.54mm
Product Series A2547 Series
Electrical characteristics Operating Voltage (V AC/DC) 250
Current(Max)(A) 3
Contact Resistance 20mΩMax
Insulation Resistance 1000MΩMin
Configuration Features Number of Rows  1
Number of Positions  2P~25P
Shell characteristics Color  Black
Material PBT,UL94V-0
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732