CJT,Equivalent to TE,Molex,JST,Amphenol ICC FCI,China connectors,Wire harness,Pin Header,Wafer,Housing,Wire to board

Terminal-2.00mm Pitch，Crimp Terminal，AWG：22#-24#

A2009F-T-A

SeriesA2009 Series
Pitch2.00mm

Cable size(AWG)22#-24#
Diameter OD1.70mm(Max)

MaterialPhosphor Bronze
PlatingTin/Gold over Nickel

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

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Terminal-2.00mm Pitch，Crimp Terminal，AWG：22#-24#

A2009M-T-A

SeriesA2009 Series
Pitch2.00mm

Cable size(AWG)22#-24#
Diameter OD1.70mm(Max)

MaterialPhosphor Bronze
PlatingTin/Gold over Nickel

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

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Housing-2.00mm Pitch，Receptacle Housing，IPX7 of IEC 60529

A2009HFA-XP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2P~4P

MaterialWhite
ColorPBT,UL94V-0

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

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Housing-2.00mm Pitch，Tab Housing，IPX7 of IEC 60529

A2009HMA-XP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2P~4P

MaterialWhite
ColorPBT,UL94V-0

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

More

Housing-2.00mm Pitch，Dual Row，Receptacle Housing，IPX7

A2009HFA-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x3P~2x4P

MaterialWhite
ColorPBT,UL94V-0

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

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Housing-2.00mm Pitch，Dual Row，Tab Housing，IPX7 of IEC 6052

A2009HMA-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x3P~2x4P

MaterialWhite
ColorPBT,UL94V-0

Current(A)3
Voltage(V)100

Wire-To-Board | Wire-To-Wire

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Housing-2.00mm Pitch，Dual Row，Housing

A2009H-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x2P~2x20P

MaterialNylon 66,UL94V-0
ColorBlack

Current(A)2
Voltage(V)250

Wire-To-Board | Wire-To-Wire

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Wafer-2.00mm Pitch，180°，Dual Row，DIP Wafer

A2009WV-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x2P~2x20P

MaterialNylon 66,UL94V-0
ColorBlack

Current(A)2
Voltage(V)250

Wire-To-Board | Wire-To-Wire

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Wafer-2.00mm Pitch，90°，Dual Row，DIP Wafer

A2009WR-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x2P~2x20P

MaterialNylon 66,UL94V-0
ColorBlack

Current(A)2
Voltage(V)250

Wire-To-Board | Wire-To-Wire

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Wafer-2.00mm Pitch，180°，Dual Row，Foot，SMT Wafer

A2009WVA-S-F-2xXP

SeriesA2009 Series
Pitch2.00mm

Number of Rows2
Number of Positions2x2P~2x20P

MaterialNylon 66,UL94V-0
ColorBlack

Current(A)2
Voltage(V)250

Wire-To-Board | Wire-To-Wire

More

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