Product centerWire-To-Wire-C6201

Housing-5.70mm Pitch,Dual Row,Housing
C6201HFB-2xXP
Wire-To-Board  | Wire-To-Wire
Meets The EU RoHS Directive 2011/65/EU Claim
Meets The EU ELV Directive 2000/53/EC Claim
SeriesC6201 Series
Pitch5.70mm
MaterialNylon 66,UL94V-0
ColorBlack
Matching Wafer:

C6201WVB-F-2xXP 5.70mm Pitch,180°,Dual Row,Foot,DIP Wafer,  
C6201WVB-F1-2xXP 6.20mm Pitch,180°,Dual Row,Foot,DIP Wafer,  
C6201WRB-F-2xXP 5.70mm Pitch,90°,Dual Row,Foot,DIP Wafer,  

Matching Terminal:

C6201FB-TCA 5.70mm Pitch,Crimp Termina,AWG14#~16#,  
C6201FB-TCA-H 5.70mm Pitch,Crimp Termina,AWG12#,  

Product Type Features Category Wire To Wire
Assembly Type Housing
Pitch (mm) 5.70mm
Product Series C6201 Series
Electrical characteristics Operating Voltage (V AC/DC) 600
Current(Max)(A) 23
Contact Resistance 7mΩMax
Insulation Resistance 1000MΩMin
Configuration Features Number of Rows  2
Number of Positions  2x1P~2x6P,2x6P
Shell characteristics Color  Black
Material Nylon 66,UL94V-0
Use the environment Operating Temperature Range (°C) -40℃~105℃
Industry Standard UL/CUL E326732